The birth of BGA ball grid array has made a great contribution to the development of PCB circuit boards. BGA is a surface mount package, with this package, microprocessors and other devices can be permanently installed on the fast PCB manufacturing. The low inductance of BGA enables it to provide excellent electrical performance. They have good thermal conductivity, so the heat generated by the chip or IC will be transmitted through the entire PCB, which can prevent the chip from overheating.

Because BGA has many advantages, it is the first choice in most PCB circuit board manufacturing companies. The following are some of the main advantages of BGA that make it popular in the PCB manufacturing process. BGA improves connectivity. In this way, you can achieve high-speed performance. BGA has a lower trace density. This helps to improve the PCB design. It is sturdy and durable, making the circuit more durable. Soldering BGA packages requires professional knowledge, skills and practice. Hot air is used for soldering BGA. You can follow the steps below for good pcb fabrication BGA soldering.

Step 1: The first step is to paste the flux on the pad.
Step 2: Now, carefully add the solder balls to the flux applied on the pads. The solder paste prevents the solder balls from falling or changing positions.
Step 3: Carefully apply flux to the solder side of the BGA package.
Step 4: Now, place the package on the solder balls added on the pads.
Step 5: Now the packaging needs to be preheated. Hot air is applied to the top and bottom of the package.
Step 6: Applying heat will melt the solder balls and be soldered.